[ELECTRON] Proposed new club + Arduino meet up

[Brian Loudon]

Hi to those interested in RepRaps, I came across this patent relating to 
temperature and flow control for professional Fused Deposition Modelling 
systems ;

http://www.google.co.uk/patents?hl=en&lr=&vid=USPAT5866058&id=OgUXAAAAEBAJ&oi=fnd&dq=stratasys+patent+fused+deposition+modelling&printsec=abstract#v=onepage&q&f=false

The stratasys Dimension printers achieve .178 mm, .254 mm or .33 mm 
layer thicknesses,
http://www.dimensionprinting.com/3d-printers/3d-printing-comparison_chart.aspx

the reprap is quoted as a layer thickness of 0.3
http://reprap.org/wiki/Mendel

The patent above emphasises the importance of temperature and the 
professional machines all have enclosures, makes me wonder if the reprap 
performance can be optimized?

cheers

Brian